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CM1206 ESD Protection Arrays, Chip Scale Package
Features
* * * * Functionally and pin compatible with CMD's PACDN2404C/08C/16C family of devices OptiGuardTM coated for improved reliability at assembly 4, 8, or 16 transient voltage suppressors in a single package In-system Electrostatic Discharge (ESD) protection to +18kV contact discharge per IEC 61000-4-2 international standard Supports AC signal applications Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages Lead-free versions available
Product Description
The CM1206 family of transient voltage suppressor arrays provides a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-to-back Zener connections provide ESD protection in cases where nodes with AC signals are present. These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard. All I/Os are rated at +18kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The CM1206 incorporates OptiGuardTM coating which results in improved reliability at assembly. The CM1206 is also available with optional lead-free finishing.
* *
*
Applications
* * * * * * * * ESD protection for sensitive electronic equipment I/O port, keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs
Electrical Schematic
B1 B2 B3
B1 B2 B3 B4 B5
D1
D2
D3
D4
D5
A1
A2
A3
A1
A2
A3
A4
A5
C1 B1
C2 B2
C3 B3
C4 B4
C5 B5
CM1206-04CS/CP
CM1206-08CS/CP
A1
A2
A3
A4
A5
CM1206-16CS/CP
(c) 2004 California Micro Devices Corp. All rights reserved. 06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1206
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation Marking (see note 2)
BOTTOM VIEW
(Bumps Up View)
1 A B
2
3
B1 B2 A2 B3 A3
L06
CM1206-04 CSP Package
TOP VIEW
(Bumps Down View)
A1
BOTTOM VIEW
(Bumps Up View)
Orientation Marking (see note 2)
1 A B
2
3
4
5
B1 B2 A2 B3 A3 B4 A4 B5 A5
120608
TOP VIEW
(Bumps Down View)
A1
CM1206-08 CSP Package
5
D1
BOTTOM VIEW
(Bumps Up View)
Orientation Marking (see note 2)
1 A B C D
2
3
4
D2 C2 B2 A2
D3 C3 B3 A3
D4 C4 B4 A4
D5 C5 B5 A5
CM1206 16
CM1206-16 CSP Package
C1 B1 A1
Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Bumps 6 10 20 Package CSP CSP CSP Ordering Part Number1 CM1206-04CS CM1206-08CS CM1206-16CS Part Marking L06 120608 CM120616 Lead-free Finish2 Ordering Part Number1 CM1206-04CP CM1206-08CP CM1206-16CP Part Marking L06 120608 CM120616
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark
(c) 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/28/04
CM1206
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range RATING -65 to +150 UNITS C
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL VREV ILEAK VSIG PARAMETER Reverse Standoff Voltage Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Channel Capacitance CONDITIONS IDIODE=10A VIN=3.3V DC ILOAD = 10mA 6.0 -9.2 Notes 2 & 3 +30 +18 Notes 2 & 3 +14 -14 At 2.5V DC, f = 1MHz 39 47 V V pF kV kV 7.6 -7.6 9.2 -6.0 V V MIN 5.9 100 TYP MAX UNITS V nA
VESD
VCL
C
Note 1: TA=25C unless otherwise specified. GND in this document refers to the lower supply voltage. Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. Note 3: These parameters are guaranteed by design and characterization.
(c) 2004 California Micro Devices Corp. All rights reserved. 06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1206
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.300mm Round Non-Solder Mask defined pads 0.350mm Round 0.125 - 0.150mm 0.360mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
Non-Solder Mask Defined Pad 0.300mm DIA.
Solder Stencil Opening 0.360mm DIA.
Solder Mask Opening 0.350mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 2. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2004 California Micro Devices Corp. All rights reserved.
Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/28/04
CM1206
Mechanical Details
The CM1206 devices are packaged in custom Chip Scale Packages (CSP). CM1206-04 6-bump CSP Mechanical Specifications The CM1206-04 devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B1 B3 B2
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 6 Inches Nom Max
3 A2 2 1 B A C2 D1 D2
1.109 1.154 1.199 0.0437 0.0454 0.0472 1.759 1.804 1.849 0.0693 0.0710 0.0728 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.638 0.707 0.776 0.0251 0.0278 0.0306 0.394 0.445 0.495 0.0155 0.0175 0.0195 3500 pieces
SIDE VIEW
0.35 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS
# per tape and reel
Package Dimensions for CM1206-04 6-bump Chip Scale Package
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 1.98 X 1.32 X 0.91
Po Top Cover Tape
PART NUMBER CM1206-04
CHIP SIZE (mm) 1.804 X 1.154 X 0.707
TAPE WIDTH W 8mm
REEL DIA. 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W Bo
Ko
For tape feeder reference only including draft. Concentric around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 4. Tape and Reel Mechanical Data
(c) 2004 California Micro Devices Corp. All rights reserved. 06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1206
Mechanical Details (cont'd)
CM1206-08 10-bump CSP Mechanical Specifications The CM1206-08 devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B1 B2
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 10 Inches Nom Max
4 3 2 1
5
1.109 1.154 1.199 0.0437 0.0454 0.0472 3.059 3.104 3.149 0.1204 0.1222 0.1240 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.638 0.707 0.776 0.0251 0.0278 0.0306 0.394 0.445 0.495 0.0155 0.0175 0.0195 3500 pieces
A2
B
A
C2
B
A D1 D2
SIDE VIEW
0.35 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS
# per tape and reel
Controlling dimension: millimeters
Package Dimensions for CM1206-08 10-bump Chip Scale Package CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 3.28 X 1.32 X 0.81
Po Top Cover Tape
PART NUMBER CM1206-08
CHIP SIZE (mm) 3.104 X 1.154 X 0.707
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W Bo
Ko
For tape feeder reference only including draft. Concentric around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 5. Tape and Reel Mechanical Data
(c) 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/28/04
CM1206
Mechanical Details (cont'd)
CM1206-16 20-bump CSP Mechanical Specifications The CM1206-16 devices are packaged in a 20-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B1 5
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 20 Inches Nom Max
4
B2
2.409 2.454 2.499 0.0948 0.0966 0.0984 3.059 3.104 3.149 0.1204 0.1222 0.1240 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.638 0.707 0.776 0.0251 0.0278 0.0306 0.394 0.445 0.495 0.0155 0.0175 0.0195 3500 pieces
A2
3 2 1 D C B A D1 D2 B A C2
SIDE VIEW
0.35 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
# per tape and reel
Controlling dimension: millimeters
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1206-16 20-bump Chip Scale Package CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 3.28 X 2.64 X 0.86
Po Top Cover Tape
PART NUMBER CM1206-16
CHIP SIZE (mm) 3.104 X 2.454 X 0.707
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W Bo
Ko
For tape feeder reference only including draft. Concentric around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 6. Tape and Reel Mechanical Data
(c) 2004 California Micro Devices Corp. All rights reserved. 06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7

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